Nanoparticles in Slurries for Chemical Mechanical Polishing used in the Semiconductor Industry

Chemical Mechanical Polishing (CMP) is widely used in the semiconductor industry for the planarization of wafer surfaces following the deposition of layers of insulators and metals.  During the polishing process the wafer is pressed against a polishing surface, termed the polishing pad.  The wafer and the pad rotate independently from each other (see figure 1).  A CMP slurry is dispensed to the pad and forms a thin layer on it.  The combination of mechanical effects by pressure force and relative velocity applied to the slurry particles and chemical effects by the water and chemical reagants results in material removal from the wafer surface.  The CMP slurry is a suspension that ..........

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